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| Autonomous Mobile Robots (AMRs) help improve productivity and operation efficiency in manufacturing, warehousing, logistics, and so forth. For example, AMRs can carry packages in warehouses and logistic centers, vacuum-clean floors, and serve foods and drinks in restaurants. Early AMRs used to operate in workspaces restricted from humans and navigated along the predetermined path guided by lanes and AprilTags on the ground. Therefore, early AMRs did not necessitate lots of sensors and stringent functional safety features. Such robots that follow the predefined path are also called automated guided vehicles (AGVs). On the contrary, recent AMRs are equipped with advanced sensors to operate in the shared workspace with humans and navigate freely but safely through the environment to perform assigned tasks at designated locations with as little human intervention as possible. |
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| In today’s embedded design landscape, the decision to use an FPGA can be pivotal – but it is not always obvious. While many applications are well-served by off-the-shelf microcontrollers or fixed-function devices, others demand a level of flexibility, performance, and integration that standard components cannot deliver. |
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| techUK is set to lead a discussion on the UK’s semiconductor future at Hardware Pioneers Max 25, with a dedicated session called ‘UK Plan for Chips: Driving the UK Semiconductor Strategy Forward’. |
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| PCB Connect has confirmed its participation in the upcoming Hardware Pioneers MAX Show, taking place on 23–24th April at the Business Design Centre, Islington, London. |
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| The market for electric vehicles (EV) continues to gather pace with a strong volume growth of both battery electric vehicles (BEVs) and plug-in hybrid electric vehicles (PHEVs). The share of electric vehicles produced is expected to see double-digit growth by 2030 with a share of around 45% compared to 20% in 2024 [1]. |
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| Littelfuse announces the launch of the Pxxx0S3G-A SIDACtor Protection Thyristor Series, the first 2kA thyristors in a compact DO-214AB (SMC) package. The Pxxx0S3G-A series, designed to safeguard equipment in harsh environments from severe overvoltage transients, enables engineers to achieve greater product miniaturisation while maintaining superior protection and compliance with regulatory standards. |
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| SemiQ has announced a series of highly efficient 1,200V SiC MOSFET six-pack modules. These have been designed to enable lower cost and more compact system-level designs at large scale. |
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| At this year's PCIM Europe, Alps Alpine will be presenting a wide range of sensors, sensor modules and ICs developed for the automotive, industrial, environmental and energy markets under the motto “The world of power electronics united in one hub” in hall 5, booth 316. |
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| Panasonic, on 27 March 2025, opened Germany's first proof-of-concept for its so-called Panasonic HX, a sustainable energy solution powered by green, locally sourced green hydrogen at its Munich campus in Ottobrunn. |
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| SHENMAO announces the availability of its lead-free solder paste PF606-P for use in the cutting-edge "reverse hybrid" board assembly process. This advanced technique is gaining attention across the electronics industry for its ability to deliver superior reliability and higher yield rates in modern device manufacturing. |
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