EnSilica, a maker of mixed-signal ASICs (Application Specific Integrated Circuits), has announced it has established a new engineering hub in Cambridge, UK.

EnSilica has announced two Ku-band beamformer integrated circuits, the ENS92051 and ENS92052, which offer best-in-class power consumption and performance. They are designed to address the needs of the next generation of electronically steered antennas for a range of user terminals used with LEO, MEO, and GEO satellite constellations.

EnSilica has been awarded an $18m design and supply contract by a leading European based supplier of electromechanical products for a Cortex M series Arm-based mixed signal sensor interface application-specific IC (ASIC) to be used across a range of automotive and industrial applications.

Mixed-signal ASICs specialist EnSilica has opened a second design centre in Brazil after a series of design wins, the most recent being a multimillion-pound design and manufacturing contract from an optical computing systems customer.

In partnership with the European Space Agency (ESA), EnSilica will design and develop a key silicon component to enable next-generation resilient multi-band Global Navigation Satellite System (GNSS) capabilities. These are vital to ensuring the world’s critical infrastructure and services remain robust and secure in the face of evolving global threats.

EnSilica has announced that it has been awarded funding from the UK Space Agency under its Connectivity in Low-Earth Orbit (“C-LEO”) programme.

Avant Technology and EnSilica have announced a strategic partnership: Avant has been appointed the sales representative for EnSilica focusing on promoting its advanced eSi-Crypto IP, including their latest post-quantum cryptography (PQC) solutions.

SIAE MICROELETTRONICA, a provider of microwave radio and wireless network solutions, has selected EnSilica, a turnkey supplier of mixed signal ASICs and SoCs, to assist the design of Application-Specific Integrated Circuits (ASICs) for its next-generation telecommunication infrastructure products.

Omni Design Technologies and EnSilica have announced an extended partnership for the Swift Data Converter IP portfolio.

EnSilica has announced that it has joined the Design Center Alliance (DCA) of TSMC Open Innovation Platform (OIP).

EnSilica has added a range of Post-Quantum Cryptography (PQC) accelerators to its eSi-Crypto range of hardware accelerator IP.

Ensilica has revealed its collaboration with VITES to provide a beamformer chip tailored for satellite user terminals. Central to VITES's new ViSAT-Ka-band terminal, this chip will facilitate the design.

Ensilica has announced the development of a custom chassis-control ASIC, which has entered mass production, and will appear in vehicles later this year.

Ensilica has created a customisable single-chip medical sensor ASIC platform to speed the development of wearable medical / fitness vital-sign monitoring products.

EnSilica has announced it is developing a single-chip Ka band satellite transceiver IC for the European Space Agency. The mmWave IC will form a key component of next-generation, low-cost hybrid automotive communication terminals – enabling vehicles to always be connected.

Alternative SME credit specialist Caple has supported d EnSilica, a leading bespoke chip design and supply firm, with a £3.7m fully unsecured loan.  This will enable EnSilica to continue its expansion into high-growth sectors including automotive, space and the Internet of Things (IoT). EnSilica funds the design and supply of silicon chips for customers and then takes a share of the revenues once the chip design is proven.  G...

EnSilica has won the Queen's Award for International Trade. This latest and most prestigious award for EnSilica reflects the dynamic growth that the company has achieved over the last three years. Ian Lankshear, Managing Director and co-founder commented, "We are honoured to receive this recognition for everyone's hard work in turning EnSilica into major force in the British electronics Industry."  

  EnSilica has announced that it has become an Arm Approved Design Partner. The company is experienced in developing digital and mixed signal SoCs and has been integrating third party IP into designs since EnSilica was founded in 2001.

  EnSilica has announced that it is extending its full service of chip design through to volume supply to meet the increasing requirements from the automotive market. To support this, the company has signed a Representative Agreement with Lojixx Technologies, who have many years of experience in the automotive market with market knowledge.

A key innovation that will help the rapid development of autonomous cars has been announced by EnSilica. Its eSi-ADAS RADAR Imaging Co-processor will accelerate the commercialisation of autonomous vehicles by solving the current problem of RADAR data overload and resolution by handling this in a dedicated co-processor to enable tracking of potentially hundreds of objects to be made in real time.