imec have announced their collaboration with Massachusetts Institute of Technology (MIT) to research nanoelectronics-based solutions for minimally and non-invasive diagnostic devices for personalised medicine.

eyeo, a new imec spin-off, announced it has raised €15 million in seed funding, co-led by imec.xpand, Invest-NL, joined by QBIC fund, High-Tech Gründerfonds (HTGF) and Brabant Development Agency (BOM).

At the IEEE International Reliability Physics Symposium (IRPS) 2025, imec demonstrated that, despite their positive bias (on-state) instability, GaN MISHEMTs (Metal-Insulator-Semiconductor High Electron Mobility Transistors) maintain consistent performance when operating within a well-defined range.

imec, a research and innovation hub in nanoelectronics and digital technologies, and the State Government of Baden-Württemberg, Germany, have announced the launch of the Advanced Chip Design Accelerator (ACDA).

In a world-first, imec has successfully built and tested a proof-of-concept photonics-enabled code-division multiplexing (CDM) frequency-modulated continuous wave (FMCW) 144GHz distributed radar system that ensures coherent chirps to remote radar units.

imec and ZEISS are intensifying their collaboration by signing a strategic partnership agreement (SPA) to advance the NanoIC pilot line at imec with state-of-the-art semiconductor technology and manufacturing expertise for sub-2nm research and development.

Imec announced that Johny Srouji, Apple’s Senior Vice President of Hardware Technologies, will receive the 2025 imec Innovation Award.

This week at SPIE Advanced Lithography + Patterning, imec presents the first electrical test results obtained on 20nm pitch metal line stuctures patterned after single-exposure High NA EUV lithography.

Imec achieves breakthrough in silicon photonics, paving the way for cost-effective and high-performance optical devices.

At the 2024 IEEE International Electron Devices Meeting (IEDM), imec, a global research and innovation hub in nanoelectronics and digital technologies, and its partners in the Belgian project Q-COMIRSE, present a first of its kind prototype shortwave infrared image sensor with indium arsenide quantum dot photodiodes.

This week, at the 2024 IEEE International Electron Devices Meeting (IEDM), imec demonstrates the three critical building blocks of a superconducting digital circuit: NbTiN-based interconnects; Josephson junctions; and MIM capacitors.

At the 2024 IEEE International Electron Devices Meeting (IEDM), imec, a leading research and innovation hub in nanoelectronics and digital technologies, presents a new CFET-based standard cell architecture containing two rows of CFETs with a shared signal routing wall in between.

At an exclusive event in Ann Arbor, Michigan, the Automotive Chiplet Forum 2024 brought together key players in the global automotive ecosystem to discuss the shift towards chiplets in vehicles. 

imec, together with 13 European partners, announces the development of a high-performance lithium-metal solid-state battery.

Imec, a global research and innovation hub in nanoelectronics and digital technologies, has announced the demonstration of high quality 300mm-Si-based quantum dot spin qubit processing with devices resulting in a statistically relevant, average charge noise of 0.6µeV/ÖHz at 1Hz.

At this week's IEEE Symposium on VLSI Technology & Circuits, imec introduced two advanced ADCs for base stations and handsets.

This week, at the 2024 IEEE Symposium on VLSI Technology & Circuits (2024 VLSI), imec presents for the first time electrically functional CMOS CFET devices with stacked bottom and top source/drain contacts.

At this week’s IEEE RFIC Symposium, imec, a global pioneering research and innovation hub in nanoelectronics and digital technologies, presents a state-of-the-art CMOS-based beamforming transmitter for D-band wireless applications.

Imec, a global research and innovation hub in nanoelectronics and digital technologies, and ASML, a pioneering lithography supplier to the semiconductor industry, have announced the opening of the High NA EUV Lithography Lab in Veldhoven, the Netherlands, a lab jointly run by ASML and imec.

At IEEE ECTC 2024, imec presented a Cu-to-Cu and SiCN-to-SiCN die-to-wafer bonding process resulting in a Cu bond pad pitch of only 2µm at <350nm die-to-wafer overlay error, achieving good electrical yield. Such fine-grained die-to-wafer interconnects pave the way to logic/memory-on-logic and memory-on-memory applications. On the longer term, die-to-wafer bonding will enable also die- and wafer-level optical interconnects – for whi...