Design

TrustInSoft has announced the latest release of its flagship product, TrustInSoft Analyzer (TISA), featuring major enhancements to the TISA Project Manager GUI and the introduction of a new REST API for software development tool integration.

A British robotics expert has attracted millions of views on YouTube after unveiling a battery-powered bicycle that replaces traditional wheels with large self-balancing spheres.

Electronics manufacturing is at a pivotal moment. Devices are becoming smaller, more advanced, and increasingly complex – while the regulations governing their production are growing stricter and more nuanced. Environmental responsibility, workplace safety, and regulatory compliance are no longer optional – they are essential components of any resilient, forward-looking manufacturing strategy.

Researchers at Queensland University of Technology (QUT) have identified a new material with potential applications as a flexible semiconductor for wearable devices, using a technique known as vacancy engineering to enhance its performance. The study, published in Nature Communications, focused on improving the thermoelectric properties of an AgCu(Te, Se, S) alloy—comprising silver, copper, tellurium, selenium, and sulphur—by precisel...

Vishay has introduced a new AEC-Q200 qualified thick film power resistor in the compact, low profile SOT-227B package for mounting on a heatsink.

Synopsys has announced its ongoing close collaboration with TSMC to deliver robust EDA and IP solutions for TSMC's most advanced processes and advanced packaging technologies to accelerate AI chip design and 3D multi-die design innovation.

Master Bond UV15-7HP is a low viscosity, easy to apply, one-part, UV curable adhesive system. Optimal adhesion is achieved in bond line thicknesses of 0.001-0.003”, and it can cure rapidly with a minimum intensity of 20-40 milliwatts/cm2 using a UV light source emitting at a wavelength of 320-365nm.

TTI IP&E – Europe will showcase a range of IP&E products designed for use in harsh factory and process automation environments at this year’s SPS Italia.

Researchers have developed a novel approach to detecting spin states in diamond-based quantum systems, offering the potential for more compact and accessible quantum sensors.

SHENMAO announces the availability of its lead-free solder paste PF606-P for use in the cutting-edge "reverse hybrid" board assembly process. This advanced technique is gaining attention across the electronics industry for its ability to deliver superior reliability and higher yield rates in modern device manufacturing.