Beneath the surface are two hydrofoils - underwater wings - to power the C-8 and lift it above the water, reducing drag and cutting energy consumption by 80% compared with conventional vessels. This milestone enables the long electric range required to cross the Strait of Gibraltar - one of the world’s busiest shipping lanes - for the first time.

First intercontinental journey made using electric boat is a post from: Electronic Specifier which is not allowed to be copied on other sites.

More recently, the company responded to customer requests by introducing a full range of audio components, including ceramic elements, transducers, buzzers, microphones, and filters.

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Kickboxing competition puts humanoid robots to the test is a post from: Electronic Specifier which is not allowed to be copied on other sites.

The EDGE AI FOUNDATION Pavilion will feature innovative solutions from leading technology providers, offering attendees an immersive look into the latest breakthroughs in Edge AI hardware, neuromorphic computing, and ultra-efficient machine learning for real-world applications.

EDGE AI FOUNDATION Pavilion at Sensors Converge is a post from: Electronic Specifier which is not allowed to be copied on other sites.

The central functions of this solution include push-to-talk (PTT) and full-duplex individual calls, group calls, emergency calls, voice prioritisation, status displays, geo-referencing, status messages, dynamic train numbers and many other operationally relevant services, which have already proven themselves in practical use on secondary lines for several years. Additionally, the Kontron MCx solution takes into account the requirements of the state railway supervisory authorities (LEA).

Kontron to supply radio solution for railway companies is a post from: Electronic Specifier which is not allowed to be copied on other sites.

Due to their compact design, IPX8-certified variants and high mechanical robustness (up to 10,000 mating cycles), the components are particularly suitable for applications where reliability and continuous operation are key. Various mounting options – including vertical, top and mid-mount versions – offer maximum design flexibility in a small space.

Rutronik offers Molex USB Type-C connectors is a post from: Electronic Specifier which is not allowed to be copied on other sites.

By maintaining local stock of high-demand products, the company ensured consistent supply and supported distributor reliability.

Orion Fans, IO Audio Technologies at EDS Leadership Summit 2025 is a post from: Electronic Specifier which is not allowed to be copied on other sites.

The demonstration will focus on mobile communications in the 5G FR2, n257 band. Mobile communications in this frequency range experience a high path loss, which can be solved using beamforming antenna arrays.

Kyocera, Rohde & Schwarz to demo OTA characterisation of mmWave PAAM is a post from: Electronic Specifier which is not allowed to be copied on other sites.

A key differentiator, said Raley, is Waldom’s ability to hold a substantial breadth of inventory which it resells to a network of more than 2,500 distributor partners. Unlike traditional distribution models that rely on rapid stock turnover, Waldom specialises in long-tail excess inventory and can hold components for extended periods until demand returns, extracting value for suppliers in the process.

Waldom Electronics at EDS Leadership Summit 2025 is a post from: Electronic Specifier which is not allowed to be copied on other sites.

Omron says that the G5Q has become a global standard for compact power relays having sold more than 500 million units since its launch in 2001.

Relay adds latching contact options is a post from: Electronic Specifier which is not allowed to be copied on other sites.

That renewed activity has come alongside a sharp expansion in supplier engagement. DigiKey added over 100 new suppliers in Q1 2025 alone – a move aimed at strengthening its role as a comprehensive, one-stop shop for customers.

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To meet demand, binder is offering a wide range of M12 panel mount connectors for this area of application. The portfolio covers a wide variety of codings, connection types, materials and fastening solutions, thus offering maximum design freedom for integration into devices and systems.

binder moves to meet panel mount connector requirements is a post from: Electronic Specifier which is not allowed to be copied on other sites.

Bourns specifically designed its new shielded power inductors with these features to meet the latest DDR5 memory technology specifications such as those in DDR5 Power Management Integrated Circuits (PMIC) and client DDR5 modules in desktop PCs, notebooks and tablets.

Shielded power inductors meet DDR5 memory specifications is a post from: Electronic Specifier which is not allowed to be copied on other sites.

It also features smart wake-up capabilities for deeply discharged batteries and soft-start charging, delivering low current until normal voltage levels are restored – critical for preserving battery health.

Mascot unveils MCU-based battery charger is a post from: Electronic Specifier which is not allowed to be copied on other sites.

Integrating antenna protection, the new devices substantially simplify the RF connection to the MCU. In addition to ensuring optimal performance, integrated matching and filtering also increases reliability and reduces overall cost by eliminating the need to combine multiple discrete components.

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With the addition of this new facility and technical expertise, EnSilica will expand its existing mmWave/RF integrated circuit design capabilities, an area in which the company has already seen significant customer demand. The expansion has been facilitated by the recent UK Space Agency C-LEO-funded award, alongside additional contract momentum and customer wins that continue to support the company’s growth.

EnSilica establishes new engineering hub in Cambridge, UK is a post from: Electronic Specifier which is not allowed to be copied on other sites.

CISSOID has been a specialist in power semiconductor solutions since 2011, delivering multi-phase, high-current power switching modules, motor control systems and software, across a wide range of power requirements.

Cissoid’s modular SIC inverter platform from Rhopoint Components is a post from: Electronic Specifier which is not allowed to be copied on other sites.

Over the past 30 years, Direct Insight has trained thousands of engineers on a diverse range of topics in electronics and embedded systems design and development, including VHDL, FPGA design, and cyber security, reflecting the breadth of expertise of its staff. The company is currently rolling out training to assist its customers in adopting the provisions of the CRA (Cyber Resilience Act).

Get prepared for Cyber Resilience Act (CRA) compliance is a post from: Electronic Specifier which is not allowed to be copied on other sites.

To carry out this demonstration, the company has implemented an advanced bosonic code known as Tesseract code. This provides the system protection against many common types of errors including bit flips, phase flips, and control errors. Another key advantage over single-mode encoding is that leakage errors, which remove the qubit from the encoding space, can now be detected.

Nord Quantique develops bosonic qubit technology is a post from: Electronic Specifier which is not allowed to be copied on other sites.

While the report acknowledged that AI was unlikely to result in the wholesale replacement of occupations, it warned of widespread transformation within many roles. Tasks within affected jobs may shift substantially as AI becomes capable of performing a broader range of cognitive functions.

Women face a greater risk of disruption from AI is a post from: Electronic Specifier which is not allowed to be copied on other sites.

1. Define flex and rigid areas

Start by clearly distinguishing which areas of the board will be flexible and which will be rigid. This will affect material selection, stack-up design, bend reliability, and component placement. Early planning reduces the need for costly redesigns later. Rigid areas can be just mechanical stiffeners or traditional FR4 material that include areas with standard PTHs (Plated Thru Holes).

Top 10 design rules for flex and rigid-flex PCBs is a post from: Electronic Specifier which is not allowed to be copied on other sites.

Seam sealing plays a key role in vehicle safety and longevity, protecting against corrosion, moisture ingress and vibration, while also contributing to a smooth paint finish and professional appearance. With modern vehicles requiring a variety of seam types — standard, brushed, spray, PVC structure and more, bodyshop professionals must master a range of application methods to deliver factory-quality results.

Henkel adds new module to e-learning platform is a post from: Electronic Specifier which is not allowed to be copied on other sites.

During the specification phase, there is a need to understand surface energy and wettability in a quantitative way, to ensure adhesion. In the production phase, measuring surface energy takes on a more qualitative and process control function.Dyne Pens and Inks can be used to assess surface energy and wetting.

Hints and tips for Dyne pens is a post from: Electronic Specifier which is not allowed to be copied on other sites.

‘CHO KABUKI Powered by IOWN’ tells the story of Princess Miku (performed by Hatsune Miku) and Tadanobu (performed by Shidō Nakamura), who battle the Azure Dragon while traveling through the legendary Thousand Cherry Blossoms that span from the Age of Gods to the present day. Through the IOWN APN, the movements of performers in Taiwan were transmitted in real time to Japan, where they were synchronised with performers at the Osaka Expo site to create a unified production – as if the distant performers were sharing the same stage in-person.

World-first theatre performance using photonic network is a post from: Electronic Specifier which is not allowed to be copied on other sites.

In the HIPE project (Human-technology Interoperability and Artificial Emotional Intelligence), VTT, Teleste and Ambientia have developed a service concept and technology platform that combines cameras, sensors, data analytics, audio and video analysis, and AI. This system continuously measures the emotional atmosphere inside a tram or bus and provides real-time information that can be used to improve passenger comfort and safety.

AI-powered tram senses mood on board and prevents disturbances is a post from: Electronic Specifier which is not allowed to be copied on other sites.

Key benefits of Ubuntu Pro integration:

ASRock and Canonical partner on Edge AIoT is a post from: Electronic Specifier which is not allowed to be copied on other sites.

The PREVAIL project aims to provide Europe with an accessible, advanced manufacturing infrastructure that enables users to create early research samples of innovative and reliable Edge AI products, accelerating their path to commercialisation. By advancing their cutting-edge technologies to higher maturity levels and enabling users to fabricate and evaluate AI demonstrators, the RTOs benefit from technological cross-fertilisation.

EU consortium PREVAIL to open services to customers is a post from: Electronic Specifier which is not allowed to be copied on other sites.

The SL2000 is a modular platform that combines the functions of a mixed signal oscilloscope and a data acquisition recorder, and is designed to capture fast signal transients and long-term trends. It is suitable for applications such as R&D, validation, and troubleshooting.

Yokogawa unveils high-speed data acquisition unit is a post from: Electronic Specifier which is not allowed to be copied on other sites.

Typically, when lighting up LEDs for use as a residual power display in power tools and other applications, functions are used where components are combined discretely or are equipped with a microcontroller, etc. However, these solutions have disadvantages including that when components are combined discretely, it increases the number of components, requiring more space on the board, and if a microcontroller is used, it increases the amount of current consumption.

ABLIC launches voltage monitoring ICs is a post from: Electronic Specifier which is not allowed to be copied on other sites.

The survey offers a deep dive into the North American connector market, revealing critical insights about technology adoption, engineering challenges, and industry trends.

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Würth Elektronik, based in Waldenburg, Germany, operates with 23 production sites worldwide, making it one of the most successful entities within the Würth Group. In 2024, the company employed around 7,500 people and achieved sales of €1.02 billion.

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Bosch has recognised TRI's valuable contribution to their success in MEMS packaging in 2025 with a Certificate of Appreciation. The certificate acknowledges the successful completion of the AI visual check for MEMS packaging, highlighting the strong cooperation and partnership between the two companies.

TRI and Bosch develop AI solution for MEMS packaging is a post from: Electronic Specifier which is not allowed to be copied on other sites.

Comprising software and a sensing box device installed onto the front of the train, the new sensor system combines radar, thermal camera, satellite positioning, and AI. The system can detect humans and animals from more than 200 metres  (more than 218 yards) and signal the driver of the vehicle instantly.

VTT new sensor system to improve road safety is a post from: Electronic Specifier which is not allowed to be copied on other sites.

At its booth, Advantech will present a selection of real-world transport applications enabled by its industrial-grade computing solutions. Demonstrations will include:

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According to a survey by the European Commission's information service for research and development (CORDIS), around 28 billion primary batteries are currently thrown away every year. The production of this type of battery requires on average 50 times the energy it can store, without the entire stored energy of the cell ever being used. The nPM2100 power management IC (PMIC) significantly extends the service life of primary cells and the products equipped with them, therefore helping to reduce battery waste.

Rutronik adds Nordic's nPM2100 to range is a post from: Electronic Specifier which is not allowed to be copied on other sites.

With the growth of AI, the power required per data centre rack is predicted to increase from 100kW today to more than 1MW in the near future. To power a 1MW rack, today’s 48V distribution system would require almost 450lbs of copper, making it physically impossible for a 48V system to scale power delivery to support computing needs in the long term.

TI teams with NVIDIA to power AI infrastructure is a post from: Electronic Specifier which is not allowed to be copied on other sites.

The operating temperature range of LEDs for industrial applications typically goes up to just 85°C. Würth Elektronik extends this range to 100°C, opening up new fields of application. The unusually heat-resistant LEDs provide manufacturers of devices operating in hot or otherwise challenging environments with greater reliability. This includes industrial or automation solutions, street or outdoor lighting, as well as event and stage technology. Other applications are found in devices that are used very intensively, such as in the medical field, as well as energy-efficient lighting used in machine or server rooms.

Würth Elektronik extends its RGB LED product series is a post from: Electronic Specifier which is not allowed to be copied on other sites.

“To overcome this challenge we developed a novel Aluminium Nitride ceramic package that offers high thermal conductivity and closely matches the Coefficient of Thermal Expansion of the silicon image sensor. This unique packaging provides efficient heat extraction from the image sensor die and enables a wide operating temperature range," said Phil Brown, General Manager of SI Sensors. “Mounting the Kirana large area image sensor with high precision within the ceramic package also presented significant challenges.

SI Sensors collaborates with ESCATEC is a post from: Electronic Specifier which is not allowed to be copied on other sites.

It continues to produce and manufacture products that are up to date with these advancements, with a new catalogue released to commemorate its anniversary featuring hundreds of new products.

Keystone Electronics at EDS Leadership Summit 2025 is a post from: Electronic Specifier which is not allowed to be copied on other sites.

“We want to stock the most part numbers of every supplier,” Stanciu explained, when talking about the company’s commitment to availability and fast service.

Master Electronics at EDS Leadership Summit 2025 is a post from: Electronic Specifier which is not allowed to be copied on other sites.

During the conversation, West invites Stack to explore how Sager differentiates itself from larger global distributors, particularly through its power programme. Stack explains that what began as a niche offering has grown into a specialised focus that includes thermal management, custom battery systems, and modular power solutions. She also highlights that Sager has developed these capabilities “both organically as well as through acquisition,” supporting a shift from standard parts to more tailored solutions.

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No matter where they’re deployed, from deserts to outer space, each connector must interconnect systems flawlessly.

Mission-ready connectors is a post from: Electronic Specifier which is not allowed to be copied on other sites.

Unlike previous amphibious robots that often suffer from limitations in agility, dynamics, and load-bearing capacity, this latest model replicates the dog’s paddling gait to allow for natural and efficient movement across different terrains. The result is a machine that transitions more effectively between land and aquatic environments.

Bioinspired robotic dog for land and water operations is a post from: Electronic Specifier which is not allowed to be copied on other sites.

“We’re thrilled to recognise this year’s finalists – each one represents a breakthrough or milestone in sensing technology and electronics,” said David Drain, Show Director, Sensors Converge. “From AI and MEMS to power efficiency and automotive solutions, this year’s finalists reflect the dynamic, interdisciplinary innovation happening across the industry. We look forward to honouring them live at Sensors Converge.”

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The collaborative research, conducted by the Institute of Science Tokyo (Science Tokyo), University of the Arts London, Bunkyo Gakuin University, and Hosei University, introduced the world’s first VR-based cognitive training method that specifically targets the sense of smell.

Smell your way to better brain health is a post from: Electronic Specifier which is not allowed to be copied on other sites.

Built for high-performance Edge AI

Equipped with Intel 13th Gen Core processors (up to 65W, socket LGA1700) and supporting up to 64GB DDR5 4800 memory, the FPC-21W42 provides high-throughput data processing and accelerated AI inferencing at the Edge. This enables real-time analytics and machine learning across smart manufacturing, healthcare, retail, and more.

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Many new-generation electronic products offer higher power in a smaller package, intensifying thermal management challenges for OEM and CEM electronics companies in the telecommunications, IT, consumer, power conversion, medical device, defence, and transportation markets. To help engineers overcome these issues, Parker Chomerics showcases a wide range of TIMs in its updated catalogue.

Parker Chomerics updates thermal interface materials catalogue is a post from: Electronic Specifier which is not allowed to be copied on other sites.

Why do code errors happen in the first place

At the core of most AI code assistants is a large language model (LLM). These models are trained on billions of lines of code and learn to predict the code that comes next based on patterns.

AI is getting better at coding, but mistakes still happen is a post from: Electronic Specifier which is not allowed to be copied on other sites.

NVLink Fusion: a new model for AI data centre infrastructure

NVLink Fusion is a silicon architecture developed by NVIDIA that enables hyperscalers to build custom compute platforms using NVIDIA’s high-speed interconnect ecosystem. It supports flexible integration with various processing units, including NVIDIA GPUs, Grace CPUs, and other custom accelerators. With its rack-scale design, co-packaged optics switches, and control software, the technology is designed to allow different silicon types to operate efficiently within a common infrastructure standard.

MediaTek collaborates with NVIDIA to develop custom AI silicon is a post from: Electronic Specifier which is not allowed to be copied on other sites.

The new Series 3 families of SoCs include

SiXG301: optimised for line-powered applications

Silicon Labs unveils first Series 3 portfolio SoCs is a post from: Electronic Specifier which is not allowed to be copied on other sites.

The new lineup consists of six models in three package configurations, including two ultra-compact (1.0 × 0.6mm), ultra-thin (t=0.2mm) products as part of the PICOLED series: SML-P14RW and SML-P14R3W.  In addition, there are four variants in the industry-standard (1.6 × 0.8mm) size, featuring a narrow beam circular lens package (CSL0902RT, CSL0902R3T) and flat lens design that emits light over a wide range (CSL1002RT, CSL1002R3T). Each package is available in two wavelengths, 850nm (860nm for the SML-P14RW) and 940nm, allowing customers various options for their specific application needs. The 850nm wavelength is ideal for phototransistors and camera sensors, making it suitable for high-sensitivity applications such as eye tracking and object detection in VR/AR. At the same time, the 940nm wavelength is less affected by sunlight and does not appear red when emitting light, making it suitable for motion sensors. It is also widely used in biosensing applications such as pulse oximeters to measure blood flow and oxygen saturation (SpO2).

ROHM develops compact surface-mount near-infrared LEDs is a post from: Electronic Specifier which is not allowed to be copied on other sites.

The RPCQ series boasts pulse capability that is 1.5 to 2x greater than the best comparable pulse-withstanding chip resistors currently available. This performance allows the RPCQ to be utilised in applications that previously required larger or more expensive components, thereby saving valuable board space.

Automotive chip resistor offers high pulse capability is a post from: Electronic Specifier which is not allowed to be copied on other sites.

The operating temperature range is 0°C to +70°C and the RF connectors are N female input / SMA female output. BroadWave manufactures a wide variety of resistive power dividers in 2, 3, 4, 5, 6, and 8-way configurations. Available connector types are BNC, N, SMA, and TNC or mixed connector types for unique applications.

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Explains Dr Chema Molina, Founder and CEO of Frenetic: “Frenetic AI turns a complex, multi-hour design process into a seamless, intuitive workflow. Engineers can move from specs to simulation in minutes. Basic users receive full magnetic specs automatically, advanced users can deep-dive into detailed customisation and simulation options.”

Frenetic uses AI and ML to enhance Cloud magnetics speed and accuracy is a post from: Electronic Specifier which is not allowed to be copied on other sites.

“Within the New Space industry, some system designers may use COTS sensors and make them fly with no upscreening, which means that they take the risk of any malfunctions or errors further down the line,” explains Céline Semécas, Product Marketing Manager, Teledyne e2v. “Teledyne e2v’s industrial upscreened image sensors are tested for space and are delivered as flight models with lot validation test certificates and radiation test reports.”

Teledyne Space Imaging launches industrial image sensors tested for space is a post from: Electronic Specifier which is not allowed to be copied on other sites.

As global AI applications diversify rapidly, Gartner’s Top 10 Strategic Technology Trends for 2025 identified autonomous AI, humanoid robots, and advanced computing as key drivers transforming industries. COMPUTEX 2025 focused on three topics – AI & Robotics, Next-Gen Tech, and Future Mobility – spotlighting both cutting-edge development and real-world deployment.

COMPUTEX 2025 concludes successfully is a post from: Electronic Specifier which is not allowed to be copied on other sites.

“This collaboration with Trescal marks a significant step in enhancing our service capabilities in the USA,” says James Gould, North American General Manager of Pickering Interfaces. “Our customers will benefit from faster turnaround times and reduced shipping costs for calibration services.”

Pickering Interfaces seals service pact with Trescal is a post from: Electronic Specifier which is not allowed to be copied on other sites.

Eaton DPQ Product Line Manager Christophe Jammes comments, “Our latest UPS delivers market-leading efficiency of up to 97.2% in the 11kW unit thanks to innovative silicon carbide (SiC) components that not only use less power and therefore cut energy bills but also put operators one step ahead in emissions reduction.”     

New UPS brings advanced technology upgrades is a post from: Electronic Specifier which is not allowed to be copied on other sites.

The Ezurio Veda SL917 Wi-Fi 6 + Bluetooth LE 5.4 modules are based on the Silicon Labs SiWx917 chipset, purpose-built for IoT connectivity requiring Wi-Fi, Bluetooth, Matter, and IP networking for secure cloud connectivity. The modules are ideal for battery-operated devices that need extended operating and battery life.

Wi-Fi6, BLE 5.4 modules include SoC, NCP options is a post from: Electronic Specifier which is not allowed to be copied on other sites.

The survey ratings are based on direct customer feedback representing more than 46% of the world’s chip producers, which include integrated device manufacturers (IDMs), fabless companies, and outsourced assembly and test (OSAT) providers.

Advantest tops customer survey for sixth successive year is a post from: Electronic Specifier which is not allowed to be copied on other sites.

BOM cost reduction and simplified design are achieved through optimized functions.

Low-end MCU cuts BoM costs, simplifies design is a post from: Electronic Specifier which is not allowed to be copied on other sites.

However, the purpose of this is often misunderstood. The primary reason isolators are utilised has less to do with the impedance matching of the amplifier, but rather the impedance matching of the load.

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This provided a mere glimpse of how deeply embedded Imagination is getting into AI. The E-Series focuses on providing its customers with Edge AI capabilities, Beets told Electronic Specifier in an exclusive briefing. Although this continues work that began with the release of its B-Series, the E Series represents its first time where the company has been heavily guided by the requirements of running AI workloads.

Imagination "embraces" Edge AI capabilities in its GPUs is a post from: Electronic Specifier which is not allowed to be copied on other sites.

Marx brings a unique perspective to the company's innovative approach. With a background in physics and extensive experience in embedded development and cybersecurity, Marx understands the complex landscape of protecting industrial and IoT devices.

Series 18 – Episode 3 – security for embedded systems is a post from: Electronic Specifier which is not allowed to be copied on other sites.

The ENS92052 is the Ku-band transmitter supporting eight channels with separate amplitude and phase control. The Tx carrier frequency range 13.75 to 14.5GHz with an instantaneous bandwidth of 125MHz.

EnSilica expands Ku-band beamformer chipset range is a post from: Electronic Specifier which is not allowed to be copied on other sites.

This strategic partnership aims to strengthen the AI + AIoT hardware ecosystem, expand product offerings, and enhance the one-stop solution experience for customers.

Accordance and InWin to present Edge solution at COMPUTEX 2025 is a post from: Electronic Specifier which is not allowed to be copied on other sites.

“Pulsar is not just another AI chip – it represents a fundamental shift in how we bring intelligence to the Edge,” says Sumeet Kumar, Co-Founder and CEO of Innatera. “This launch is the culmination of over a decade of deep research and engineering in neuromorphic computing, combined with a groundbreaking heterogeneous architecture. It marks the moment that our brain-inspired technology becomes ready for mass-market deployment. As demand for real-time, power-efficient intelligence in Edge devices continues to grow, Pulsar delivers the capabilities that traditional AI hardware simply can’t – ultra-low latency, minimal power draw, and on-device decision-making. More importantly, it lays the foundation for a new class of intelligent systems that are adaptive, autonomous, and scalable. Pulsar is our first major step toward making that future a reality.”

Pulsar: the mass-market neuromorphic microcontroller for the sensor Edge is a post from: Electronic Specifier which is not allowed to be copied on other sites.

The full list of 10 online, self-paced SEMI U AI and data analysis courses in partnership with Purdue University are now available. The courses are taught by industry experts and offer a certificate from Purdue upon successful completion of each course module.

SEMI and Purdue University launch AI and data analysis online courses is a post from: Electronic Specifier which is not allowed to be copied on other sites.

The collaboration is poised to introduce various initiatives to support the long-term growth of the technology sector in Qatar such as joint seminars, workshops, and conferences to facilitate knowledge sharing and networking. Invest Qatar will also work closely with Ardian and Silian Partners to organise exploratory fact-finding trips for related companies to learn more about Qatar’s welcoming and supportive business environment and to experience the country’s high quality of life.

Invest Qatar partners to boost AI and chips is a post from: Electronic Specifier which is not allowed to be copied on other sites.

The SiEH4800EW implements a fused lead to increase the source PAD solderable area to 3.35mm², which is four times larger than a traditional PIN solder area. This decreases the current density between the MOSFET and PCB, reducing the risk of electro-migration risk and enabling a more robust design. In addition, the device's wettable flanks enhance solderability while making it easier to visually inspect the reliability of solder joints.

Vishay launches 80V MOSFET with 0.88mΩ RDS(ON) is a post from: Electronic Specifier which is not allowed to be copied on other sites.

Unlike traditional architectures, which often rely on separate memory and processing units, ViTFOX aims to integrate computing directly into memory, achieving an exceptional energy efficiency of over 50 TOPS/W. The European Union is funding the project with €1.5 million.

Addressing AI limitations in traditional computing is a post from: Electronic Specifier which is not allowed to be copied on other sites.

AI Mode uses the capabilities of Google's Gemini 2.0 AI model and is a marked change in how the tech giant is reacting to what is a rapidly changing market – a market it had dominated for such a long time. No longer do users want to piecemeal together all the information they need – now they want conversational and context aware interactions where the chatbot can understand and respond to input based on the context of the conversation. It’s what they’ve come to expect.

Google introduces AI Mode sparking a change in conversation is a post from: Electronic Specifier which is not allowed to be copied on other sites.

The Department for Science, Technology and Innovation (DSIT) noted that the average £1 invested in public R&D leverages £2 in private investment and generates £7 in net benefits to the UK economy long-term.

Government outlines ten-year R&D funding to transform UK economy is a post from: Electronic Specifier which is not allowed to be copied on other sites.

The toolkit launch follows a special drop-in event hosted in Parliament last week by Perran Moon MP, where EVA England and a host of its members – all EV drivers – briefed MPs on the benefits of owning an EV and the biggest barriers facing consumers. The event highlighted the increasingly urgent need for demand-side policy action to support consumers to match the Government’s recent steps to support industry, such as through its recent changes to the Zero Emission Vehicle (ZEV) Mandate that is guiding EV manufacturers through the transition, towards the confirmed 2030 phase-out date for new petrol and diesel cars.

MPs briefed in Parliament on key electric vehicle challenges is a post from: Electronic Specifier which is not allowed to be copied on other sites.

"NAMUGA's launch of Stella-2 is a powerful example of how Lumotive's Light Control Metasurface technology is enabling the next generation of intelligent, adaptable 3D sensing solutions," said Dr. Sam Heidari, CEO of Lumotive. "We're proud to support NAMUGA in delivering a versatile LiDAR platform that meets the real-world needs of robotics and industrial automation, and we're excited to see our technology drive broader adoption of solid-state LiDAR across new markets."

NAMUGA to debut 3D LiDAR sensor powered by Lumotive is a post from: Electronic Specifier which is not allowed to be copied on other sites.

Healthcare remains one of the most important global socio-economic challenges, particularly as life expectancy increases. Achieving personalised treatment through tailored monitoring of vital signs and biomarkers has proven challenging but necessary. Recent progress in semiconductor technology has brought us closer to this objective.

imec and MIT join forces on personalised healthcare is a post from: Electronic Specifier which is not allowed to be copied on other sites.

“WORKS Integration ensures that all production data is available exactly where it is needed for things like production planning and setup preparation, material flow and process optimization, and quality control,” said Thomas Bliem (pictured), Vice President R&D at ASMPT SMT Solutions. “By creating a centrally networked database with high connectivity across all systems, the platform makes fully digitized and highly automated intelligent production possible.”

ASMPT adds data exchange to electronics manufacturing is a post from: Electronic Specifier which is not allowed to be copied on other sites.

Air gapped cores are typically made to special order or are application specific, TDK have developed a range of distributed air gap (DG) ferrite cores using their highly automated production processes which has resulted in them being able to offer a standardised and cost-effective range of DG products.

Ferrite cores increase power density and reduce size is a post from: Electronic Specifier which is not allowed to be copied on other sites.

Also on display will be Dukosi’s contactless 54-channel container demo which spotlights the recently announced reference design for battery energy storage systems (BESS).

Dukosi showcases cell monitoring at Stuttgart event is a post from: Electronic Specifier which is not allowed to be copied on other sites.

This allows manufacturers to test and optimize their automation systems before any equipment is installed, optimizing efficiency and reducing deployment risks. A key highlight of the exhibition will be the Digital Battery Passport, developed in collaboration with Circulor.

Digital Battery Passport centre stage in Stuttgart is a post from: Electronic Specifier which is not allowed to be copied on other sites.

As detailed in a report published in Nature Materials, the scientists stacked two ultra-thin layers of graphene, each layer one-atom-thick sheet of carbon atoms arranged in a hexagonal grid. They then twisted them atop a layer of hexagonal boron nitride, a hexagonal crystal made up of boron and nitrogen. A subtle misalignment between the layers formed moiré patterns – patterns similar to those seen when two fine mesh screens are overlaid – and significantly altered how electrons moved through the material.

Discovery of intercrystals with unique properties is a post from: Electronic Specifier which is not allowed to be copied on other sites.

Today’s existing data center architecture uses traditional 54 V in-rack power distribution and is limited to a few hundred kilowatts (kW). Bulky copper busbars are required to transfer this low-voltage electricity from the rack-mounted power shelves to the compute trays.

NVIDIA, Navitas collaborate on 800 V HVDC architecture is a post from: Electronic Specifier which is not allowed to be copied on other sites.

Memfault offers a platform for monitoring, debugging, and securely updating embedded/IoT devices deployed in the field. The system collects critical data including crashes, errors, health metrics, and usage analytics, allowing developers to detect and resolve issues quickly, even in remote environments.

Variscite, Memfault partner on SoM management is a post from: Electronic Specifier which is not allowed to be copied on other sites.

It is designed to enable wideband 5G, NR, instantaneous signal bandwidths of up to 530 MHz, making it ideally suited for the N77 band critical for 5G deployment and other mMIMO applications.

5G amplifier enables bandwidths to 530MHz is a post from: Electronic Specifier which is not allowed to be copied on other sites.

Designed to significantly reduce the need for external components, the PIC32A MCUs are cost-efficient, high-performance solutions for automotive, industrial, consumer, artificial intelligence (AI), machine learning (ML) and medical applications.

32-bit MCUs suit math-intensive applications is a post from: Electronic Specifier which is not allowed to be copied on other sites.

His colleague Goce Talaganov focuses on ensuring 5G NTN device performance, presenting market trends, use cases, challenges, and test solutions.

Rohde & Schwarz reveals Satellite Industry Day program is a post from: Electronic Specifier which is not allowed to be copied on other sites.

This initiative is part of the Queensland Quantum and Advanced Technologies Strategy, which aims to position Queensland as a leader in quantum innovation and shape the future of jobs and industries.

Duo picked to back Australian quantum project is a post from: Electronic Specifier which is not allowed to be copied on other sites.

“Today’s launch marks a major milestone in our strategy to democratize access to high-performance PCB design and bring the transformative power of AI to the PCB design workflow,” said AJ Incorvaia, senior vice president, Siemens EDA. “With PADS Pro Essentials and Xpedition Standard, we’re delivering scalable solutions that help smaller teams move faster, work smarter, and design with confidence without sacrificing quality or budget.”  

Siemens democratizes AI-driven PCB design for SMEs is a post from: Electronic Specifier which is not allowed to be copied on other sites.

This collaboration further strengthens industry cooperation on security standards that complement manufacturers' efforts to address regulatory requirements through standardised approaches to vehicle software updates.

eSync Alliance welcomes VicOne as member is a post from: Electronic Specifier which is not allowed to be copied on other sites.

As data volumes surge and broadcast infrastructure continues to evolve, the need for faster, more efficient interconnect solutions has never been greater. L2Tek’s distribution of new 800G solutions ensures UK customers can access reliable, high-performance transceivers that support a wide range of deployment scenarios, from short-reach data centre interconnects to long-haul transport links.

L2Tek introduces portfolio of Eoptolink and Gigalight is a post from: Electronic Specifier which is not allowed to be copied on other sites.

“CAPAS has engaged in Southwest China’s automotive market for over a decade with an eye to support the development of an ecosystem across vehicle manufacturing, supply chain and aftermarket services," said Mr James Yu, General Manager of Messe Frankfurt (Shanghai). "Leveraging the region’s distinct landscape, CAPAS continues to enhance its focus on automotive culture by offering interactive experiences that cater to diverse market demands. We aim to facilitate resource sharing and business matchmaking that promotes close collaboration across the industrial chain, unveiling the potentials in the region’s automotive market.”

CAPAS Chengdu to officially open is a post from: Electronic Specifier which is not allowed to be copied on other sites.

A railway-certified embedded computer with four single-pair Ethernet interfaces is now available for the first time. According to Benjamin Gassler, Syslogic's Product Manager, this allows proven sensor technology from the automotive sector to be integrated into railway applications.

Syslogic introduces powerful railway computer is a post from: Electronic Specifier which is not allowed to be copied on other sites.

The ready-to-use simulation files facilitate integration into SPICE-based analyses and help shorten design cycles and time-to-market. Conventional models of components for ESD protection typically rely on simplified approximations. The new models developed by Würth Elektronik and the IFE at Graz University of Technology, based on measurement data, however, reflect the actual transient properties, including snapback behaviour.

Würth now offers LTspice model for ESD products is a post from: Electronic Specifier which is not allowed to be copied on other sites.

One of its notable features is the increased photosensitive area of its photo pixels, each measuring 56 µm × 600 µm. This new pixel geometry provides significantly higher contrast and signal yield in low light conditions. The latter also enables shorter measurement times. At the same time, the increased height of the pixels allows larger position tolerances during installation by compensating for lateral offset or slight rotation. This greatly simplifies the installation process without compromising measurement accuracy.

iC-Haus presents newest addition to image sensors is a post from: Electronic Specifier which is not allowed to be copied on other sites.

The 3-Phase interleaved totem-pole power factor correction (TP-PFC) is powered by Gen-3 Fast SiC MOSFETswith ‘trench assisted planar’ technology, which has been enabled by over 20 years of SiC innovation leadership and offers world-leading performance over temperature, delivering cool-running, fast-switching, and superior robustness to support faster charging EVs and up to 3x more powerful AI data centres.

Navitas unveils 12kW power supply unit at COMPUTEX is a post from: Electronic Specifier which is not allowed to be copied on other sites.

The World of Photonics Congress 2025 will comprise five conferences with more than 3,000 scientific presentations and poster sessions. It will cover the entire range of topics from basic research to practice-oriented developments and industrial applications.

World of Photonics Congress 2025 is a post from: Electronic Specifier which is not allowed to be copied on other sites.

These jellyfish have to deal with the ebb and flow of the currents they encounter, but do not make decisions about how best to navigate to a destination and cannot be remotely controlled.

Caltech researchers learn from jellyfish to develop underwater bot is a post from: Electronic Specifier which is not allowed to be copied on other sites.

Key product features and benefits

• High drive capability: 1.5A source and 2.5A sink output drive current
• Wide supply voltage range: operates from 6.5V to 18V with UVLO protection
• Integrated bootstrap circuitry: on-chip bootstrap diode and resistor simplify design
• Logic level compatibility: interfaces directly with TTL and CMOS levels (down to 3.3V)
• Cross-conduction protection: prevents simultaneous high-side and low-side conduction
• Ultra-low standby current: less than 1µA standby mode for energy efficiency
• Thermal robustness: operates from -40°C to +125°C

“With the IXD0579M, Littelfuse is offering a direct drop-in replacement for popular industry-standard gate driver ICs,” said June Zhang, Product Manager, Integrated Circuits Division at Littelfuse. “This gives customers greater flexibility to secure supply while simplifying their circuit design with an integrated solution.”  

Littelfuse IXD0579M high-side and low-side gate driver is a post from: Electronic Specifier which is not allowed to be copied on other sites.

The RAC20NE-K/277 series is highly efficient, allowing reliable operation at full load to 60°C ambient, and to 85°C with derating. The parts are Class II insulated, OVC III rated to 3,000m altitude (OVC II/5000m) and meet EN 55032 ‘Class B’ EMC requirements with a floating or grounded output. Standby and no-load power dissipation meet eco-design requirements.

Versatile AC/DC power supplies deliver 20W in small form factor is a post from: Electronic Specifier which is not allowed to be copied on other sites.

The rapid rise of AI is driving an explosive demand for compute power, presenting opportunities for innovation in semiconductor technology. As traditional semiconductor scaling reaches its limits, the industry is turning to heterogeneous integration – the advanced packaging of different types of chips into a single system – to achieve exceptional compute performance and enhanced energy efficiency. This shift introduces greater complexity in manufacturing and underscores the critical importance of process control and precision metrology to ensure production yield and efficiency.

Nearfield and A*STAR IME partner on semiconductor metrology is a post from: Electronic Specifier which is not allowed to be copied on other sites.

Sir Jeremy, in his role heading GCHQ, advised successive Prime Ministers, and served on the National Security Council and Joint Intelligence Committee. Sir Jeremy played a pivotal part in managing the UK’s response to major security incidents, including the WannaCry cyber-attack on the NHS, the Novichok poisonings in Salisbury, and strategic responses to geopolitical challenges including the invasion of Ukraine. His distinguished career began at MI5 in 1993, where he led critical operations, including the response to the 2005 London terrorist attacks and security preparations for the London 2012 Olympics.

Sir Jeremy Fleming appointed to Board of Oxford Quantum Circuits is a post from: Electronic Specifier which is not allowed to be copied on other sites.

The winning tender was from IQM Quantum Computers, whose bid was an excellent match with the strategic objectives of the project, the quantum computing performance requirements, as well as schedule requirements. The joint development project now signed will deliver a 150-qubit superconducting quantum computer in mid-2026 and a 300-qubit one in late 2027. The quantum computers will be integrated into the Finnish high-performance computing infrastructure to promote hybrid computing.

IQM Quantum Computers to supply Finland with 300-qubit quantum computer is a post from: Electronic Specifier which is not allowed to be copied on other sites.

In the English session, KC Liu, Chairman of Advantech, engaged in a keynote dialogue with Dr. Lee-Feng Chien, former Managing Director of Google Taiwan, highlighting how Edge Computing and Agentic AI were driving the real-world implementation of intelligent applications and accelerating industrial transformation. In addition, Miller Chang, President of Advantech Embedded Sector, was in conversation with Nakul Duggal, Group General Manager, Automotive and Industrial & Embedded IoT, Qualcomm Technologies, while Linda Tsai, President of Advantech Intelligent System Sector, had a dialogue with Deepu Talla, VP and GM of Robotics and Edge AI, NVIDIA. These high-level exchanges with global tech leaders explored the pivotal role of Edge AI in autonomous systems and robotics (AS&R), while fostering collaborative ecosystem development. The discussions further explored how to usher in a new era of physical AI and industrial automation, transitioning from theoretical concepts to practical applications, and helping businesses achieve intelligent transformation to lead in the competitive market.

Advantech kicked off COMPUTEX 2025 with ‘Edge Computing & WISE-Edge in Action’ is a post from: Electronic Specifier which is not allowed to be copied on other sites.

To foster developer innovation, Qualcomm Technologies is collaborating with Advantech to help them deliver a developer-oriented toolchain for Edge AI development and deployment. Leveraging Advantech’s deep expertise in embedded markets, the companies are utilising Qualcomm Technologies’ robust enablement platforms –including Edge Impulse, and Foundries.io – and integrating Advantech’s EdgeAI SDK to provide no-code/low-code model training tools and a rich model zoo. This enables developers to accelerate time-to-market and efficiently scale intelligent edge solutions.

Advantech and Qualcomm collaborate to accelerate Edge AI innovation for IoT is a post from: Electronic Specifier which is not allowed to be copied on other sites.

As indicated in Asahi Kasei’s 2023 automotive survey, as driverless vehicles become more prevalent, passengers increasingly emphasise in-cabin experiences. Together, the two companies aim to meet the rising demand for immersive in-car entertainment while addressing OEMs’ pain points of taxing tuning processes.

Asahi Kasei Microdevices and Dirac partner on in-car audio is a post from: Electronic Specifier which is not allowed to be copied on other sites.

While the connector interface includes an O-ring seal, this series of backshells does not provide additional environmental protection to the connector and cable and are designed to be used without heat shrink boots over the connector-to-cable transition. For EMC screen termination variants, the LMA19 Series is available, for ultra-low-profile style, consider the LMA67 Series and for heat shrink boot backshells select the LMA79 Series.

Two new series of connector backshells from Weald is a post from: Electronic Specifier which is not allowed to be copied on other sites.

“We are excited to further extend and strengthen our highly successful mosaic module family. The new receivers answer the growing demand for precise and reliable positioning and GNSS heading in high-volume drone and robotic applications,” said François Freulon, Director of Product Management, Septentrio.

Septentrio unveils smallest GNSS receivers yet is a post from: Electronic Specifier which is not allowed to be copied on other sites.

"Viper RF is pleased to be invited to be part of the WIN Alliance. We have worked with WIN Semiconductors for more than fifteen years and have used a full range of their GaN and GaAS technologies in space, defence and telecommunications applications," said Jim Mayock, CEO of Viper RF. “WIN’s technologies offer world-class performance and cost-effective solutions for our clients. We look forward to working more closely with WIN to support their clients and accelerate our own product developments and R&D activities.”

Viper RF joins WIN Alliance program is a post from: Electronic Specifier which is not allowed to be copied on other sites.

The ST4SIM-300 is among one of the first certified eSIMs to support SGP.32, the specification suited to IoT devices with minimal user-interface capabilities or connectivity constraints such as narrowband-only communication. Special features of SGP.32 include bulk provisioning of SIM profiles to simplify managing large fleets of devices, provisioning without SMS, and a lightweight profile template for optimised downloads.

ST completes GSMA certification for IoT eSIM is a post from: Electronic Specifier which is not allowed to be copied on other sites.

Indium Corporation will showcase a wide range of cutting-edge solutions designed to meet the thermal, mechanical, and reliability demands of modern power electronics systems, including:

Indium at SEMICON Southeast Asia is a post from: Electronic Specifier which is not allowed to be copied on other sites.

“We are committed to enhancing the performance and range of electric vehicles jointly with innovative automotive companies like Rivian,” said Stefan Obersriebnig, Head of the Product Line for high voltage modules in Infineon’s Automotive Division. “Our dedication for innovation and zero-defect quality has made us the preferred partner of the automotive industry. With our broad product portfolio, system expertise and manufacturing capabilities, we are a key enabler of emission-free, sustainable mobility.”

Infineon to supply Rivian's R2 platform with SiC modules is a post from: Electronic Specifier which is not allowed to be copied on other sites.

EP3HTSDA-2Med cures quickly with heat. Cure schedule options include heating at 250°F for 20-30 minutes or 300°F for 5-10 minutes, with an optional post cure to optimise overall performance properties. The system bonds well to many substrates, including but not limited to metals, ceramics, plastics, and silicon dies.

Master Bond epoxy passes standard is a post from: Electronic Specifier which is not allowed to be copied on other sites.

Providing durability and corrosion resistance the body and shell of the adapter is designed with passivated stainless steel. Gold-plated beryllium copper contacts guarantee superior conductivity and dependable reliability. The insulator is made with natural-colored ULTEM and provides superlative dielectric properties. These PFAS free adapters are highly suited for use with advanced testing and measurement equipment within research & development labs.

Amphenol RF introduces high-performance adapters is a post from: Electronic Specifier which is not allowed to be copied on other sites.

As the automotive industry advances toward software-defined vehicles, ADAS, and autonomous driving, cybersecurity is more crucial than ever. Modern vehicles have become interconnected ecosystems, generating and transmitting vast amounts of real-time data. While this creates new opportunities, it also introduces cyber threats that can compromise safety, privacy, and operational integrity. Xiphera specialises in secure and optimised cryptographic IP cores for SoCs and FPGAs. The company’s hardware-based security solutions – designed and built entirely in-house – are engineered to protect critical automotive systems from data breaches, unauthorised access, and emerging threats such as quantum computing. By partnering with Siemens Cre8Ventures, the companies enable automotive OEMs and Tier 1 suppliers to integrate Xiphera’s cryptographic IP directly into their digital twin models on Siemens’ PAVE360 platform. This allows early-stage security validation, ensuring vehicles are secure by design before a single component hits the production line.

How Xiphera addresses unmet needs in the automotive industry

Post-quantum cryptography (PQC) readiness:

Xiphera and Siemens Cre8Ventures partner on automotive security and EU Chips Act is a post from: Electronic Specifier which is not allowed to be copied on other sites.

"Semiconductor engineering is among the most complex, consequential, and high-stakes scientific endeavours of our time, which makes it an extremely compelling use case for artificial intelligence," said Raja Tabet, SVP of Engineering Excellence Group, Synopsys. "By integrating Synopsys' pioneering AI-driven design solutions with Microsoft Discovery, we can realise the promise of agentic AI, re-engineer chip design workflows, supercharge engineering productivity, and accelerate the pace of technology innovation.”

Microsoft and Synopsys realise benefits of AI for chip design is a post from: Electronic Specifier which is not allowed to be copied on other sites.

“I am delighted to have been appointed President of the OPEN Alliance,” said Pramod Kumar.“We are establishing automotive Ethernet as a universal, non-proprietary solution that meets the needs of all equipment manufacturers within the industry. Collaboration and shared learning are pivotal to this and we will continue working with OEMs to address their challenges effectively and ensure interoperability of all available automotive Ethernet products in the market.

OPEN Alliance appoints new President is a post from: Electronic Specifier which is not allowed to be copied on other sites.

With SCALEXIO FSX, dSPACE increases the flexibility of its HIL offering and provides test engineers with a number of benefits, including customised test systems for different requirements within a comprehensive test strategy can be efficiently implemented thanks to the modular design. SCALEXIO places particular emphasis on the seamless transition between the systems. This means that not only real-time applications, but also system configurations can be expanded and reused. In addition, the systems are easy to handle – hardware modifications and extensions can be implemented by users themselves.

dSPACE expands real-time platform is a post from: Electronic Specifier which is not allowed to be copied on other sites.

Offering excellent first-order diffraction efficiency below 200nm, these gratings enable more usable light in critical applications such as high-resolution spectroscopy, advanced lithography, and precision biomedical instrumentation. Customers benefit from better diffraction efficiencies, improved system throughput, and seamless availability – without the delays of custom sourcing.

Edmund Optics expands deep UV portfolio is a post from: Electronic Specifier which is not allowed to be copied on other sites.

As the demand for innovative and interactive displays continues to grow, microLED technology has emerged as a promising contender for future display applications due to its exceptionally high brightness, while maintaining a minimal footprint, leaving room to integrate additional functions. These properties expand the boundaries of traditional displays by making microLED an ideal candidate for integrating both display and sensing functions. However, achieving seamless co-integration between microLED and photodetectors has remained a major technical challenge. Few studies have addressed this issue until CEA-Leti's new research.

CEA-Leti reports co-integration of GaN MicroLED and OPDs for multifunctional display applications is a post from: Electronic Specifier which is not allowed to be copied on other sites.

Along with exceptional resistance to humidity and high temperatures, Ultra K85 has superior flexibility and elongation (30%), which provides good peel resistance. Its low odour and low blooming characteristics make it well suited to applications where appearance is important. It provides a clean finish with no white residue without sacrificing speed or bond strength.

The first ‘instant’ adhesive for harsh applications is a post from: Electronic Specifier which is not allowed to be copied on other sites.

Mental health scores have got worse over the past 12 months and automotive workers cited they believe employers need to do more to support them, with one in nine people personally affected by a lack of support for mental health in the workplace. The survey results continue to show that automotive workers are more likely to experience issues with work-life balance and mental health, compared to other UK workers. Furthermore, mental health issues remain the most prominent of the top 10 issues, affecting hundreds of people in the automotive industry. 

Ben’s latest survey shows stress remains automotive’s number one and growing issue is a post from: Electronic Specifier which is not allowed to be copied on other sites.

It is equipped with both Wi-Fi and Bluetooth LE capabilities facilitated by an embedded ESP32 module. The board can be powered through either USB-C or an external voltage input ranging from 3.5 V to 6.0 V, rendering it particularly suitable for single-cell 3.7 V/4.2 V LiPo battery applications.

Development board brings WiFi and BLE capabilities is a post from: Electronic Specifier which is not allowed to be copied on other sites.

Utilizing MEMS accelerometers and gyroscopes with advanced Kalman filtering, this IMU delivers precise angular velocity (±400°/s) and acceleration (±2 g) measurements.

Inertial measurement unit is stable in tough conditions is a post from: Electronic Specifier which is not allowed to be copied on other sites.

They feature a 14.1mm low mating height that allows the PCB to fit into space-limited designs. The GRACE INERTIA connectors support various efficiency and error-proofing features.

Multi-load connectors ease PCB space limitations is a post from: Electronic Specifier which is not allowed to be copied on other sites.

As a combiner it is rated for two 10 Watt signals.  It has a resistive star configuration. 

Power divider/combiner handles up to 20W is a post from: Electronic Specifier which is not allowed to be copied on other sites.

It delivers rapid, bi-directional communication with PLCs for shorter cycle times, high precision movement control and fast integration. The ANS/ANM58 PROFINET provides increased productivity across a diverse range of factory and logistics automation applications, including – but are not limited to – drives & control, packaging technology, mechanical engineering, electronics, energy generation, machine building, storage & conveyor systems.

SICK unveils next generation absolute encoder is a post from: Electronic Specifier which is not allowed to be copied on other sites.

The comprehensive global study – surveying IT leadership at organisations with minimum annual revenues of $300 million across the US, UK, EU, and APAC regions – found near-universal quantum technology adoption, with 99% of respondents already allocating budget to quantum solutions. Notably, 41% are currently investing 10% or more of their technology budgets in this emerging field.

Quantum computing investment surges across global industries is a post from: Electronic Specifier which is not allowed to be copied on other sites.

The sureFIT design service allows bespoke memory solutions to be created that are tailored to meet specific application needs. Recently, the sureCore team has been working with cutting-edge companies developing both server-AI and Edge-AI system-on-chips. In both cases the underlying memory architecture is increasingly being seen as a critical factor in delivering a competitive solution. Raw performance or ultra-low voltage operation will help move the dial respectively in the server or Edge spaces. However, to achieve the step change needed to really stand out from the crowd involves crafting a bespoke memory sub-system architecture including in-memory compute capabilities. This will reduce data traffic to and from the processor thereby increasing the efficiency of model execution.

sureCore extends its sureFIT design service is a post from: Electronic Specifier which is not allowed to be copied on other sites.

As cars become increasingly connected and software-defined, they face a rapidly evolving cyber-threat landscape. The highly integrated OrangeBox 2.0 connectivity domain controller is designed to deliver the flexibility needed to protect against these threats. The integrated high performance i.MX 94 applications processor features post-quantum cryptography acceleration, as well as new AI, safety and security capabilities. This enables active cybersecurity that uses machine learning to counter rapidly evolving threats. It also features an integrated 2.5Gbps Ethernet switch with support for software-defined networking, delivering the flexibility needed for SDVs.  

NXP’s AI-enabled OrangeBox 2.0 connectivity domain controller is a post from: Electronic Specifier which is not allowed to be copied on other sites.

The surface-mount DFN8x8 package reduces volume by more than 90% compared to existing lead-inserted packages, such as TO-247 and TO-247-4L(X), improving the power density of equipment while enabling automated assembly. Surface mounting also reduces parasitic impedance, thereby cutting switching losses and contributing to the low FoM, which improves efficiency. With less heat needing to be dissipated, high-voltage power system designs can be simpler and more compact, making them suitable for space-constrained applications or furthering miniaturisation.

Ultra-compact DFN8x8 packaged 650V SiC MOSFETs is a post from: Electronic Specifier which is not allowed to be copied on other sites.

The JXT480272T017-ZBC06 features IPS, 20K MTBF, 500 nits. IC FT5446U and 1mm cover lens. The JXT480272T017-ZBR includes all of the aforementioned features and also comes with OCA bonding.  

New cover lens and OCA bonding for 4.3” TFT displays is a post from: Electronic Specifier which is not allowed to be copied on other sites.

This revolutionary step paves the way for the implementation of advanced power delivery architectures in accelerated computing data centres and will further enhance reliability and efficiency. As AI data centres already are going beyond 100,000 individual GPUs, the need for more efficient power delivery is becoming increasingly important. AI data centres will require power outputs of one megawatt (MW) and more per IT rack before the end of the decade. Therefore, the HVDC architecture coupled with high-density multiphase solutions will set a new standard for the industry, driving the development of high-quality components and power distribution systems.

Infineon collaborates with NVIDIA on AI data centres is a post from: Electronic Specifier which is not allowed to be copied on other sites.

Included in the design is a 200 MSa/s 14-bit 20MHz AWG/Function Generator, which offers real-world waveform generation capabilities for a wide range of applications, eliminating the need for additional external equipment. Software control is via the PicoScope 7 User Interface for Windows, Mac and Linux, which even comes with free updates. 40 Serial Decoders are included at no charge to facilitate the analysis of serial bus communications, simplifying debugging and troubleshooting processes. Segmented Memory, Persistence, and Fast waveform updating in PicoScope 7 enhance waveform visualisation and analysis capabilities, enabling users to extract valuable insights efficiently. Memory segmentation can capture thousands of waveforms in quick succession and view them in the waveform buffer navigator, filtering them using criteria such as mask limit testing or measurement limits to drill down to significant waveforms. Also included are comprehensive analysis tools such as Advanced Math, Measurements, Masks and Digital Triggering for in-depth waveform characterisation and interpretation. The PicoScope software also automatically scales to take full advantage of the improved resolution of larger display sizes, including 4K ultra-high-definition models. Host computer displays are typically larger and of higher resolution than the screens of traditional benchtop oscilloscopes. This allows space for the simultaneous display of time- and frequency-domain waveforms, decoded serial bus tables, measurement results with statistics and more.

Saelig introduces additions to PicoScope 3000E series is a post from: Electronic Specifier which is not allowed to be copied on other sites.

EMI Filters and chokes are indispensable components engineered to mitigate this unwanted interference, ensuring the optimal performance, compliance and safe operating of electronic systems.

EMIS releases new shortform product catalogue is a post from: Electronic Specifier which is not allowed to be copied on other sites.

The SoC design landscape is rapidly evolving, driven in part by growing design complexity.

Siemens acquistion adds advanced timing constraints is a post from: Electronic Specifier which is not allowed to be copied on other sites.

Kythrion is the first integrated solution that combines transmit, receive, and antenna functionality within a proprietary 3D antenna-in-package (AiP) and system-in-package (SiP) architecture.

Chipset platform "can transform satcomms landscape" is a post from: Electronic Specifier which is not allowed to be copied on other sites.

Of this figure, 236,357 were phishing attacks designed to trick staff into handing over sensitive information. A further 11,226 were logged as malware attacks, which involve hackers sending malicious software designed to damage computer systems and steal data.  The remaining attacks were logged as spam or malicious emails.

UK Science Funding HQ hit by 5.4M cyber assaults as attacks increase 600% is a post from: Electronic Specifier which is not allowed to be copied on other sites.