Infineon Technologies has announced that it will supply Rivian’s R2 platform with power modules for traction inverters.

Infineon Technologies is revolutionising the power delivery architecture required for future AI data centres. In collaboration with NVIDIA, Infineon is developing the next generation of power systems based on a new architecture with central power generation of 800V high-voltage direct current (HVDC).

Infineon has introduced the CoolGaN bidirectional switch (BDS) 650V G5, a gallium nitride (GaN) switch capable of actively blocking voltage and current in both directions.

Infineon Technologies and Visteon Corporation announced the companies have signed a Memorandum of Understanding (MOU) to advance the development of next-generation electric vehicle powertrains.

To facilitate the next generation of solid-state power distribution systems, Infineon Technologies is expanding its silicon carbide (SiC) portfolio with the new CoolSiC JFET product family.

Infineon Technologies is introducing a trench-based SiC superjunction (TSJ) technology concept.

Infineon is launching its new CoolSET System in Package (SiP), a compact, fully integrated system power controller for highly efficient power delivery of up to 60W at universal input voltage range of 85-305V AC.

Infineon has introduced the EasyPACK CoolGaN Transistor 650V module, adding to its growing GaN power portfolio.

Infineon has provided its 600V CoolMOS 8 high-voltage superjunction (SJ) MOSFET product family to LITEON for superior efficiency and reliability in server applications.

In collaboration with Infineon Technologies, startup Geomorphing Detection (GMD) has developed a system that uses radar sensors to continuously monitor streams and rock movements in the Alps.

Infineon Technologies launched its new CoolSiC MOSFET 750 V G2 technology, designed to deliver improved system efficiency and increased power density in automotive and industrial power conversion applications.

Infineon Technologies has introduced the XENSIV 4th generation TLE4960x magnetic switch family.

Infineon Technologies and Marelli, an automotive systems manufacturer, are partnering to advance automotive display technology with an innovative MEMS laser beam scanning (LBS) system.

At PCIM Europe 2025 in Nuremberg, Infineon will showcase its latest semiconductor, software and tooling solutions that help to solve today’s green and digital transformation challenges.

The market for electric vehicles (EV) continues to gather pace with a strong volume growth of both battery electric vehicles (BEVs) and plug-in hybrid electric vehicles (PHEVs). The share of electric vehicles produced is expected to see double-digit growth by 2030 with a share of around 45% compared to 20% in 2024 [1].

Watch our exciting webinar and discover the power conversion topologies for bidirectional EV charging. Don'tmiss out on this electrifying opportunity! Register now to join us for the webinar and discover the potential of bidirectional charging.  Today's global challenges of decarbonization, combined with rising energy demand, make bidirectional electric vehicle charging and how semiconductor solutions support this application more impor...

As vehicle architectures transition to hybrid and electric models, conventional battery systems are increasingly being supplemented or replaced by 48V power sources. This shift is expected to become the new standard for future electric vehicles, as 12V and 24V power net systems reach their limits.

The rise of renewable energy and electric vehicles is placing unprecedented demands on the electricity grid. A smart charging infrastructure (SCI) is essential to maintain grid stability, improve efficiency, and create new commercial opportunities. In this whitepaper, Infineon explores: What makes a charging infrastructure truly smart and more.

Infineon Technologies, working with its partner RT-Labs, has integrated six Fieldbus and Ethernet-based protocols in the firmware of the Infineon XMC7000 industrial microcontroller. 

Infineon has allowed Enphase Energy to simplify its system design and reduce assembly costs.