Design

As electronics become smaller, lighter, and more complex, flexible printed circuits (FPCs) and rigid-flexible printed circuit boards (RFPCBs) have become the preferred choice for leading product designers. From aerospace and medical devices to wearables, industrial sensors, and new energy applications, these technologies offer versatility where traditional rigid boards fall short.

Understanding a substrate’s surface energy is a worthwhile part of any bonding or coating process – or any process which involves adhesion.

Siemens Digital Industries Software is making its AI-enhanced electronic systems design technology more accessible to small and mid-sized businesses (SMB) with PADS Pro Essentials software and Xpedition Standard software.

Electronic circuits use zero-ohm jumpers to simplify routing, manufacturability, testing, and enable various design options. Jumpers with higher current capability allow for a smaller jumper chip to be used which can reduce the space needed for a design. Traditional thick film jumpers handle up to 3 amps, while high-current versions max out at 10 amps. 

The two new no-clean special fluxes HTW-48 and HTW-49 from Emil Otto are fluxes for high-temperature applications in the soft soldering area, which are also available as flux gel. Both fluxes are suitable for thermode soldering as well as for cable assembly.

CELUS has unveiled its next generation of AI driven hardware design on its Design Platform that simplifies the design process, accelerates time to market and maximizes opportunities to better meet customer needs.

Biosensor applications are a growth application area, where material technologies, bioengineering, and sensor design are continuously and rapidly evolving. Among the various types of biosensors, electrochemical (EC) biosensors are relevant for the printing industry as some of the components of EC biosensors are already being manufactured by printing technologies.

Indium Corporation Technical Manager, Europe, Africa, and the Middle East, Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, 20-22nd May in Amsterdam, Netherlands.

SHENMAO America is pleased to highlight the benefits of its PF606-PW220 lead-free water-soluble solder paste.

Solid Sands, a provider of verification and qualification technology for C and C++ compilers and libraries, is thrilled to announce the successful attainment of ISO 9001 certification.